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Appendix J: Hardware Bill of Materials (BOM)

Purpose: Contains the complete hardware specification (Bill of Materials) for assembling a Core Node, including the primary and alternative configurations, procurement sources, estimated prices (April 2026, USD), and acceptance procedure.


Component Model Qty Unit Price Total
GPU (anchor) NVIDIA RTX PRO 6000 Blackwell (96 GB GDDR7) 1 $18,500 $18,500
GPU (secondary) NVIDIA RTX 5090 Ti (32 GB GDDR7) 2 $7,500 $15,000
CPU AMD Ryzen Threadripper 7960X (24 cores) 1 $2,800 $2,800
Motherboard ASUS Pro WS TRX50-SAGE WIFI (sTR5) 1 $1,200 $1,200
RAM 256 GB (4×64 GB) DDR5 ECC 1 kit $3,200 $3,200
NVMe SSD Samsung 990 Pro 4 TB 2 $450 $900
Power Supply Seasonic Prime TX-2200 (2200 W, 80+ Titanium) 1 $800 $800
UPS APC Smart-UPS SRT3000 (3000 VA / 2700 W) 1 $3,500 $3,500
IP-KVM PiKVM v4 Plus 1 $350 $350
Watchdog Arduino Uno R4 WiFi + 5V relay 1 $50 $50
Network Card Mellanox ConnectX-5 25GbE (SFP28) 1 $300 $300
Cooling Case + fans (Fractal Design Meshify 2 XL + Noctua) 1 kit $500 $500
Total $47,100

J2. Alternative Configurations

J2.1. Budget Configuration (Vagrant + Arbtiragius only)

Component Model Qty Price
GPU NVIDIA RTX 5090 Ti (32 GB) 2 $15,000
CPU AMD Ryzen 9 9950X3D (16 cores) 1 $1,200
RAM 128 GB DDR5 ECC 1 kit $1,600
NVMe 2× 2 TB Samsung 990 Pro 2 $400
PSU Seasonic Prime TX-1600 (1600 W) 1 $600
UPS APC Smart-UPS SRT2200 (2200 VA) 1 $2,500
Total ~$25,000

J2.2. Extended Configuration (Architectus + Sentinella on a single node)

Component Model Qty Price
GPU NVIDIA RTX PRO 6000 Blackwell (96 GB) 2 $37,000
GPU NVIDIA RTX 5090 Ti (32 GB) 4 $30,000
CPU AMD EPYC 9454 (48 cores) 1 $2,500
RAM 512 GB DDR5 ECC 1 kit $8,000
Platform Server build 1 $3,000
Total ~$80,500

J3. Procurement Sources (Recommendations)

  • GPU, CPU, Motherboard: New via official channels (Amazon Business, B&H Photo). Used is not recommended due to PUF degradation risk.
  • RAM, NVMe: Official resellers, mandatory ECC verification.
  • UPS: APC Authorized Resellers. Online Double-Conversion only.
  • Arduino, PiKVM, Relay: Any verified suppliers.

J4. Acceptance Procedure

  1. Visual inspection for physical damage.
  2. Serial number verification (GPU, CPU) against the order.
  3. Run hw_probe to verify declared specifications.
  4. Thermal stress test (30 min) — all GPU temperatures ≤ 85 °C.
  5. PUF enrollment — first cold start to record SRAM entropy.
  6. Generate readiness_manifest.json (see Hardware_Isolation.md).

J5. Relationship with Other Documents